The electronic packaging industry is developing fast and facing increasing standards of productivity and product quality. Products are becoming increasingly more compact and challenging to manufacture. A particular challenge in recent times has been the EU directive on waste electronic equipment (WEE), banning the use of lead in electronic solders. Lead-free soldering sets higher requirements on control during the soldering process.
In our SOLDERFLEX® product family we offer industrial gas-based solutions for process improvements through electronic soldering and related process steps.
There are nitrogen soldering solutions for improved productivity for both reflow and wave soldering machines.
* For wave soldering we offer professional nitrogen retrofit SOLDERFLEX® LIS which has:
- A wider process window
- Improved wetting
- Improved solder joint quality
- Reduced number of defects such as opens, bridges and others; less reworking
- Dross reduction up to 90% and reduced solder consumption (for wave soldering)
- Reduced maintenance
* We offer process optimization of nitrogen soldering, including soldering atmosphere measurements and optimization of nitrogen flow.
* Inert storage solutions for components - SOLDERFLEX® LIS
- Complete inert atmosphere cabinets solutions to store components safe from exposure to oxygen or moisture
* Low temperature testing solutions - SOLDERFLEX® CT
- Fast ramping rates to generate required thermal stresses
- Reaches low temperatures, down to -150°C if required
- Compact and efficient system
* We offer dry precision cleaning systems for components, based on carbon dioxide snow.
* We can provide low pressure (non-thermal) plasma treatment solutions for improved solderability by cleaning, activating, reducing and etching the surfaces to be joined.